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Preliminary data
SPP08P06P SPB08P06P
SIPMOS (R) Power-Transistor
Features
*
Product Summary Drain source voltage Drain-source on-state resistance Continuous drain current
P-Channel Enhancement mode Avalanche rated dv/dt rated 175C operating temperature
VDS RDS(on) ID
-60 0.3 -8.8
V
W
*
* * *
A
Type SPP08P06P SPB08P06P
Package
Ordering Code
Pin 1 G
PIN 2/4 D
PIN 3 S
P-TO220-3-1 Q67040-S4729 P-TO263-3-2 Q67040-S4233
Maximum Ratings,at T j = 25 C, unless otherwise specified Parameter Symbol Continuous drain current
Value -8.8 -6.2
Unit A
ID
T C = 25 C T C = 100 C
Pulsed drain current
ID puls EAS EAR
dv/dt
-35.2 70 4.2 6 kV/s mJ
T C = 25 C
Avalanche energy, single pulse
I D = -8.8 A , VDD = -25 V, R GS = 25 W
Avalanche energy, periodic limited by Tjmax Reverse diode dv/dt
I S = -8.8 A, V DS = -48 , di/dt = 200 A/s, T jmax = 175 C
Gate source voltage Power dissipation
VGS Ptot Tj , Tstg
20 42 -55...+175 55/175/56
V W C
T C = 25 C
Operating and storage temperature IEC climatic category; DIN IEC 68-1
Page 1
1999-11-22
www..com
Preliminary data
Thermal Characteristics Parameter Characteristics Thermal resistance, junction - case Thermal resistance, junction - ambient, leaded SMD version, device on PCB: @ min. footprint @ 6 cm 2 cooling area 1) Symbol min. Values typ. -
SPP08P06P SPB08P06P
Unit max. 3.6 62 62 40 K/W
RthJC RthJA RthJA
-
Electrical Characteristics, at T j = 25 C, unless otherwise specified Parameter Static Characteristics Drain- source breakdown voltage Symbol min. Values typ. -3 max. -4 A -0.1 -10 -10 0.23 -1 -100 -100 0.3 nA V Unit
V(BR)DSS VGS(th) IDSS
-60 -2.1
VGS = 0 V, I D = -250 A
Gate threshold voltage, VGS = VDS I D = -250 A, Tj = 25 C Zero gate voltage drain current
VDS = -60 V, V GS = 0 V, T j = 25 C VDS = -60 V, V GS = 0 V, T j = 150 C
Gate-source leakage current
IGSS RDS(on)
-
VGS = -20 V, VDS = 0 V
Drain-source on-state resistance
W
VGS = -10 V, I D = -6.2 A
1Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm2 (one layer, 70 m thick) copper area for drain connection. PCB is vertical without blown air. Page 2
1999-11-22
www..com
Preliminary data
Electrical Characteristics, at T j = 25 C, unless otherwise specified Parameter Symbol Values min. Dynamic Characteristics Transconductance typ.
SPP08P06P SPB08P06P
Unit max.
gfs Ciss Coss Crss td(on)
1.5 -
3.6 335 105 65 16
420 135 95 24
S pF
VDS2*I D*RDS(on)max , ID = -6.2 A
Input capacitance
VGS = 0 V, V DS = -25 V, f = 1 MHz
Output capacitance
VGS = 0 V, V DS = -25 V, f = 1 MHz
Reverse transfer capacitance
VGS = 0 V, V DS = -25 V, f = 1 MHz
Turn-on delay time ns
VDD = -30 V, V GS = -10 V, ID = -6.2 A, RG = 6 W
Rise time
tr
-
46
69
VDD = -30 V, V GS = -10 V, ID = -6.2 A, RG = 6 W
Turn-off delay time
td(off)
-
48
72
VDD = -30 V, V GS = -10 V, ID = -6.2 A, RG = 6 W
Fall time
tf
-
14
21
VDD = -30 V, V GS = -10 V, ID = -6.2 A, RG = 6 W
Page 3
1999-11-22
www..com
Preliminary data
Electrical Characteristics, at T j = 25 C, unless otherwise specified Parameter Symbol Values min. Dynamic Characteristics Gate to source charge typ.
SPP08P06P SPB08P06P
Unit max.
Qgs Qgd Qg V(plateau)
-
1.4 4 10 -3.85
2.1 6 15 -
nC
VDD = -48 , ID = -8.8 A
Gate to drain charge
VDD = -48 V, ID = -8.8 A
Gate charge total
VDD = -48 V, ID = -8.8 A, VGS = 0 to -10 V
Gate plateau voltage V
VDD = -48 , I D = -8.8 A
Parameter Reverse Diode Inverse diode continuous forward current
Symbol min.
Values typ. -1.17 60 100 max. -8.8 -35.2 -1.55 90 150
Unit
IS ISM VSD trr Qrr
-
A
T C = 25 C
Inverse diode direct current,pulsed
T C = 25 C
Inverse diode forward voltage V ns nC
VGS = 0 V, I F = -8.8 A
Reverse recovery time
VR = -30 V, IF=I S , di F/dt = 100 A/s
Reverse recovery charge
VR = -30 V, IF=l S , diF/dt = 100 A/s
Page 4
1999-11-22
www..com
Preliminary data
Power dissipation Drain current
SPP08P06P SPB08P06P
Ptot = f (TC)
SPP08P06P
ID = f (TC )
parameter: VGS 10 V
SPP08P06P
50
-10
W
40 35
A
-8 -7
Ptot
30 25 20 15 10 5 0 0
ID
20 40 60 80 100 120 140 160C 190
-6 -5 -4 -3 -2 -1 0 0
20
40
60
80
100 120 140 160C 190
TC
TC
Safe operating area
Transient thermal impedance
I D = f ( VDS )
parameter : D = 0 , T C = 25 C
-10
2
ZthJC = f (tp )
parameter : D = tp /T
10 1
SPP08P06P
SPP08P06P
K/W A
tp = 12.0s
10 0
-10 1
ID
100 s
Z thJC
10 -1
V
DS
/I
D
=
D = 0.50
1 ms
on )
-10
0
R
DS (
10
-2
0.20 0.10 single pulse 0.05 0.02 0.01
10 ms
DC 10 -3
-10 -1 -1 -10
-10
0
-10
1
V
-10
2
10 -4 -7 10
10
-6
10
-5
10
-4
10
-3
10
-2
s
10
0
VDS
Page 5
tp
1999-11-22
www..com
Preliminary data
Typ. output characteristic
SPP08P06P SPB08P06P
Typ. drain-source-on-resistance
I D = f (VDS); T j=25C parameter: tp = 80 s
SPP08P06P
RDS(on) = f (ID )
parameter: VGS
SPP08P06P
-21
Ptot = 42.00W
j i
VGS [V] a
b
1.0
A
-18 -16 -14
-4.0 -4.5
W
0.8
hc
d
a
b
c
d
e
f
g
h
RDS(on)
-5.0 -5.5 -6.0 -6.5 -7.0 -7.5 -8.0 -10.0
0.7 0.6 0.5 0.4 0.3 0.2
ID
g
e f
-12 -10
e
fg
h i j
-8
d
-6
c
-4
b
-2 0 0
a
0.1 0.0 0
VGS [V] =
a b c d e f -4.0 -4.5 -5.0 -5.5 -6.0 -6.5 g h i j -7.0 -7.5 -8.0 -10.0
i
j
-2
-4
-6
-8
V
-11
-2
-4
-6
-8
-10
-12
-14
A
-18
VDS
ID
Typ. transfer characteristics I D= f ( V GS )
Typ. forward transconductance
VDS 2 x I D x RDS(on)max
parameter: tp = 80 s
-30
gfs = f(ID); Tj=25C
parameter: gfs
6
A S
-24 -22
-18 -16 -14 -12 -10 -8 -6 -4 -2 0 0 -1 -2 -3 -4 -5 -6 -7 -8
gfs
V -10 VGS
-20
4
ID
3
2
1
0 0
-2
-4
-6
-8
-10 -12 -14 -16
A -20 ID
Page 6
1999-11-22
www..com
Preliminary data
Drain-source on-state resistance Gate threshold voltage
SPP08P06P SPB08P06P
RDS(on) = f (Tj)
parameter : I D = -6.2 A, V GS = -10 V
SPP08P06P
VGS(th) = f (Tj)
parameter: VGS = VDS , ID = -250 A
-5.0
1.0
W
0.8
V
98%
-4.0
RDS(on)
0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 -60
V GS(th)
-3.5 -3.0 -2.5
typ
98% typ
2%
-2.0 -1.5 -1.0 -0.5 0.0 -60
-20
20
60
100
140 C
200
-20
20
60
100
C
180
Tj
Tj
Typ. capacitances
Forward characteristics of reverse diode
C = f (VDS)
parameter: VGS=0V, f=1 MHz
10
3
IF = f (VSD )
parameter: Tj , tp = 80 s
-10 2
SPP08P06P
A
pF
Ciss
-10 1
C
10 2
Coss Crss
-10 0
IF
Tj = 25 C typ Tj = 175 C typ Tj = 25 C (98%) Tj = 175 C (98%)
10 1 0
V
-5
-10
-15
-20
-25
-30
-40
-10 -1 0.0
-0.4
-0.8
-1.2
-1.6
-2.0
-2.4 V
-3.0
VDS
VSD
Page 7
1999-11-22
www..com
Preliminary data
Avalanche energy Typ. gate charge
SPP08P06P SPB08P06P
EAS = f (Tj)
para.: I D = -8.8 A , VDD = -25 V, R GS = 25 W
80
VGS = f (QGate )
parameter: ID = -8.8 A pulsed
SPP08P06P
-16
mJ
V
60
-12
E AS
50
VGS
-10
40
-8 0,2 VDS max 0,8 VDS max
30
-6
20
-4
10
-2
0 25
45
65
85
105
125
145
C 185 Tj
0 0
2
4
6
8
10
12 nC
15
QGate
Drain-source breakdown voltage
V(BR)DSS = f (Tj)
SPP08P06P
-72
V
-68 -66 -64 -62 -60 -58 -56 -54 -60
V(BR)DSS
-20
20
60
100
140 C
200
Tj
Page 8
1999-11-22
www..com
Preliminary data
Published by Infineon Technologies AG, Bereichs Kommunikation St.-Martin-Strasse 53, D-81541 Munchen (c) Infineon Technologies AG 1999 All Rights Reserved.
SPP08P06P SPB08P06P
Attention please! The information herein is given to describe certain components and shall not be considered as warranted characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Infineon Technologies is an approved CECC manufacturer. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Reprensatives worldwide (see address list). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
Page 9
1999-11-22


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